Coating technologies

ARC technology

Common way of coating cutting and forming tools
With ARC technology, primarily conductive materials such as metals are used as targets
High degree of ionization
Excellent adhesion
High deposition rate
Droplets increase surface roughness
(Sa ~ 0.2µm; Sz ~ 2.1µm)

SPUTTER technology

Common for decorative coatings and micro-tools
Targets with low thermal conductivity such as pure ceramics can also be SPUTTERED
Low degree of ionization
Improved adhesion through SCIL® (SPUTTERED Coating Induced by Lateral Glow Discharge) or through the PLATIT 3D module
High deposition rate thanks to SCIL®
Smooth surface free of droplets and defects
(Sa ~ 0.02µm; Sz ~ 0.3µm)

ARC vs. SPUTTER coating technology

Hybrid LACS® technology

Simultaneous ARC and SPUTTER processes to combine the advantages of LARC® cathodes with those of central SPUTTERING SCIL®

Hybrid LACS® (LAteral ARC with Central SPUTTERING):

High ion density, excellent adhesion
High deposition rates
Introduction of “new” materials by SPUTTERING of ceramic targets
Smoother coatings

Hybrid LACS coating technology

LARC® cathode
LARC® cathodes
LARC® cathodes
Shutter
SCIL® cathode
Door
Chamber
Pumping
ARC current source
ARC current source
LGD® pulsed source
ARC current source
BIAS source

High Ionized plasma by LGD® electrones stream (current) from cathode (3) to anode (2).

Sputtering deposition by SCIL® in a high ionozed plasma.

Two different types of this hybrid technology can be applied in the Pi411 coating unit

1. Simultaneous deposition by LGD® & SCIL®

Lateral Glow Discharge & SPUTTERED Coating Induced by Lateral Glow Discharge

To increase ion density and affect the coating properties of SPUTTER coatings

2. Simultaneous deposition by LARC® & SCIL®

ARC evaporation with LAteral Rotating Cathode & SPUTTERED Coating Induced by Lateral Glow Discharge

For targeted doping of coating components