- Common way of coating cutting and forming tools
- With ARC technology, primarily conductive materials such as metals are used as targets
- High degree of ionization
- Excellent adhesion
- High deposition rate
- Droplets increase surface roughness
(Sa ~ 0.2µm; Sz ~ 2.1µm)
- Common for decorative coatings and micro-tools
- Targets with low thermal conductivity such as pure ceramics can also be SPUTTERED
- Low degree of ionization
- Improved adhesion through SCIL® (SPUTTERED Coating Induced by Lateral Glow Discharge) or through the PLATIT 3D module
- High deposition rate thanks to SCIL®
- Smooth surface free of droplets and defects
(Sa ~ 0.02µm; Sz ~ 0.3µm)
- PLATIT’s patented hybrid LACS® technology combines the advantages of LARC® cathodes with those of central SPUTTERING SCIL®
- Introduction of "new" materials through the SPUTTERING of ceramics
- High degree of ionization
- Excellent adhesion
- Higher deposition rate than with SPUTTERING only, but lower than with ARC only
- Superior surface quality compared to ARC
(Sa ~ 0.1µm; Sz ~ 1.6µm)
