ARC technology
- Common way to coat cutting and forming tools
- With ARC technology, first and foremost conductive materials such as metals are used as targets
- High degree of ionization
- Excellent adhesion
- High deposition rate
- Droplets increase surface roughness
SPUTTER technology
- Common for decorative coatings and micro tools
- Targets with low thermal conductivity, such as pure ceramics, can also be SPUTTERED
- Low degree of ionization
- Improved adhesion through SCIL® (SPUTTERED Coating Induced by Lateral Glow Discharge) or through the PLATIT 3D module
- High deposition rate thanks to SCIL®
- Smooth surface
Hybrid LACS® technology
Simultaneous ARC and SPUTTER processes to combine the advantages of rotating LARC® cathodes with those of central SPUTTERING SCIL®
Hybrid LACS® (LAteral ARC with Central SPUTTERING):
- High ion density, excellent adhesion
- High deposition rates
- Introduction of “new” materials via the SPUTTERING of ceramics
- Smoother coatings
- LARC® cathode
- LARC® cathodes
- LARC® cathodes
- Shutter
- SCIL® cathode
- Door
- Chamber
- Pumping
- ARC current source
- ARC current source
- LGD® pulsed source
- ARC current source
- BIAS source
High Ionized plasma by LGD® electrones stream (current) from cathode (3) to anode (2).
Sputtering deposition by SCIL® in a high ionozed plasma.
Two different types of this hybrid technology can be applied in the Pi411 coating unit
1. Simultaneous deposition of LGD® & SCIL®
Lateral Glow Discharge & SPUTTERED Coating Induced by Lateral Glow Discharge
- To increase the ion density and influence the coating properties of the SPUTTER coatings
2. Simultaneous deposition of LARC® & SCIL®
ARC evaporation with LAteral Rotating Cathode & SPUTTERED Coating Induced by Lateral Glow Discharge
- For targeted doping of coating components