Common way of coating cutting and forming tools With ARC technology, primarily conductive materials such as metals are used as targets High degree of ionization Excellent adhesion High deposition rate Droplets increase surface roughness Common for decorative coatings and micro-tools Targets with low thermal conductivity such as pure ceramics can also be SPUTTERED Low degree of ionization Improved adhesion through SCIL® (SPUTTERED Coating Induced by Lateral Glow Discharge) or through the PLATIT 3D module High deposition rate thanks to SCIL® Smooth surface free of droplets and defects PLATIT’s patented hybrid LACS® technology combines the advantages of LARC® cathodes with those of central SPUTTERING SCIL® Introduction of "new" materials through the SPUTTERING of ceramics High degree of ionization Excellent adhesion Higher deposition rate than with SPUTTERING only, but lower than with ARC only Superior surface quality compared to ARC 
