SPUTTER technology SCIL®

Our Pi411 coating unit use the patented SCIL® (SPUTTERED Coating Induced by Lateral Glow Discharge) technology to achieve high deposition rates with SPUTTERING. SCIL® enables high-performance SPUTTERING from the central cathode.

The cathode consists of:

  • Cathode body, incl. magnetic coils with up to 30 kW SPUTTER power
  • Holed pipe for coolant inlet
  • Membrane pipe, tensed by internal cooling water for good conduction to the target rings
  • Metal or ceramic target rings

PA3D SPUTTER technology

PA3D module (PLATIT 3D module) is used in our HiPIMS coating unit PL711 to offer the following advantages compared to conventional SPUTTER technology:

  • High plasma density concentrated in the carousel
  • No plasma deadlock zones
  • No hollow cathodes
  • Minimal cleaning after DLC processes necessary
  • Higher deposition rates with uniform coating homogeneity
  • Stable coating processes < 0.1 Pa
  • Improved etching efficiency, stable etching processes < 0.2 Pa
  • Variable magnetic field strength in the SPUTTER cathodes
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