PL711 is a compact SPUTTER coating unit based on HiPIMS technology (High Power Impulse Magnetron SPUTTERING). It’s equipped with two Planar HiPIMS cathodes and enables the deposition of selected nitride as well as carbon-based coatings (WC/C, DLC2, DLC3) using highly productive processes. An efficient plasma utilization is achieved through an additional booster, the PLATIT 3D module.

The PA3D module with a central anode focuses a dense, three-dimensional plasma with a high ionization degree in the carousel and thus generates homogeneous coatings and a high deposition rate. Coatings from the PL711 provide outstandingly smooth surfaces with a high density, hardness and excellent adhesion.

Technologies applied:

  • 2 x Planar SPUTTER cathodes
  • HiPIMS technology
  • PA3D module with a central anode focuses a dense and homogeneous 3D plasma with a high ionization degree in the carousel

Etching technologies applied:

  • LGD® (Lateral Glow Discharge)
  • Plasma etching with argon, glow discharge
  • Metal ion etching (Ti, Cr)

Deposition types:

SPUTTER nitride coatings

  • Reactive and non-reactive processes
  • Targets: Ti, Zr, Cr
  • Processes at 400°C or <200°C in low temperature version


  • DLC2 (PECVD)
  • Targets: Cr
  • Processes at <200°C

SPUTTER Cr & ta-C + a-C

  • DLC3
  • Targets: C, Cr
  • Processes at <200°C

Load and cycle times:

  • Max. coating volume [mm]: ø600 x H800
  • Max. coating height with defined coating thickness: 550mm
  • Max. load: 250kg
  • 2 batches/day

Modular carousel systems:

  • 1 or 3 or 6 axes


  • Simple use and maintenance
  • PLATIT’s SmartSoftware (PC and PLC system)
  • Modern control system with touch screen
  • Data recording and real-time display of process parameters and flow
  • Manual and automatic process control
  • Remote diagnostics and maintenance

Machine dimensions:

  • Footprint [mm]: W3550 x D2800 x H2350


In order to give you a better service, this website uses cookies. By continuing to browse the site you are agreeing to our use of cookies.

I agree.