Coating technologies

ARC technology

Common way to coat cutting and forming tools
With ARC technology, first and foremost conductive materials such as metals are used as targets
High degree of ionization
Excellent adhesion
High deposition rate
Droplets increase surface roughness

SPUTTER technology

Common for decorative coatings and micro tools
Targets with low thermal conductivity, such as pure ceramics, can also be SPUTTERED
Low degree of ionization
Improved adhesion through SCIL® (SPUTTERED Coating Induced by Lateral Glow Discharge) or through the PLATIT 3D module
High deposition rate thanks to SCIL®
Smooth surface

ARC vs. SPUTTER coating technology

Hybrid LACS® technology

Simultaneous ARC and SPUTTER processes to combine the advantages of rotating LARC® cathodes with those of central SPUTTERING SCIL®

Hybrid LACS® (LAteral ARC with Central SPUTTERING):

High ion density, excellent adhesion
High deposition rates
Introduction of “new” materials via the SPUTTERING of ceramics
Smoother coatings

Hybrid LACS coating technology

LARC® cathode
LARC® cathodes
LARC® cathodes
Shutter
SCIL® cathode
Door
Chamber
Pumping
ARC current source
ARC current source
LGD® pulsed source
ARC current source
BIAS source

High Ionized plasma by LGD® electrones stream (current) from cathode (3) to anode (2).

Sputtering deposition by SCIL® in a high ionozed plasma.

Two different types of this hybrid technology can be applied in the Pi411 coating unit

1. Simultaneous deposition of LGD® & SCIL®

Lateral Glow Discharge & SPUTTERED Coating Induced by Lateral Glow Discharge

To increase the ion density and influence the coating properties of the SPUTTER coatings

2. Simultaneous deposition of LARC® & SCIL®

ARC evaporation with LAteral Rotating Cathode & SPUTTERED Coating Induced by Lateral Glow Discharge

For targeted doping of coating components