ARC technology

  • Common way of coating cutting and forming tools
  • With ARC technology, primarily conductive materials such as metals are used as targets
  • High degree of ionization
  • Excellent adhesion
  • High deposition rate
  • Droplets increase surface roughness
    (Sa ~ 0.2µm; Sz ~ 2.1µm)
ARC technology

SPUTTER technology

  • Common for decorative coatings and micro-tools
  • Targets with low thermal conductivity such as pure ceramics can also be SPUTTERED
  • Low degree of ionization
  • Improved adhesion through SCIL® (SPUTTERED Coating Induced by Lateral Glow Discharge) or through the PLATIT 3D module
  • High deposition rate thanks to SCIL®
  • Smooth surface free of droplets and defects
    (Sa ~ 0.02µm; Sz ~ 0.3µm)
SPUTTER SCIL technology surface

Hybrid technology

  • PLATIT’s patented hybrid LACS® technology combines the advantages of LARC®  cathodes with those of central SPUTTERING SCIL®
  • Introduction of "new" materials through the SPUTTERING of ceramics
  • High degree of ionization
  • Excellent adhesion
  • Higher deposition rate than with SPUTTERING only, but lower than with ARC only
  • Superior surface quality compared to ARC
    (Sa ~ 0.1µm; Sz ~ 1.6µm)
Hybrid LACS technology surface

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