Coating technologies

ARC technology

Common way of coating cutting and forming tools
With ARC technology, primarily conductive materials such as metals are used as targets
High degree of ionization
Excellent adhesion
High deposition rate
Droplets increase surface roughness
(Sa ~ 0.2µm; Sz ~ 2.1µm)

SPUTTER technology

Common for decorative coatings and micro-tools
Targets with low thermal conductivity such as pure ceramics can also be SPUTTERED
Low degree of ionization
Improved adhesion through SCIL® (SPUTTERED Coating Induced by Lateral Glow Discharge) or through the PLATIT 3D module
High deposition rate thanks to SCIL®
Smooth surface free of droplets and defects
(Sa ~ 0.02µm; Sz ~ 0.3µm)

SPUTTER SCIL technology surface

Hybrid technology

PLATIT’s patented hybrid LACS® technology combines the advantages of LARC® cathodes with those of central SPUTTERING SCIL®
Introduction of "new" materials through the SPUTTERING of ceramics
High degree of ionization
Excellent adhesion
Higher deposition rate than with SPUTTERING only, but lower than with ARC only
Superior surface quality compared to ARC
(Sa ~ 0.1µm; Sz ~ 1.6µm)

Hybrid LACS technology surface