ARC technology

  • Common way of coating cutting and forming tools
  • With ARC technology, primarily conductive materials such as metals are used as targets
  • High degree of ionization
  • Excellent adhesion
  • High deposition rate
  • Droplets increase surface roughness
    (Sa ~ 0.2µm; Sz ~ 2.1µm)

SPUTTER technology

  • Common for decorative coatings and micro-tools
  • Targets with low thermal conductivity such as pure ceramics can also be SPUTTERED
  • Low degree of ionization
  • Improved adhesion through SCIL® (SPUTTERED Coating Induced by Lateral Glow Discharge) or through the PLATIT 3D module
  • High deposition rate thanks to SCIL®
  • Smooth surface free of droplets and defects
    (Sa ~ 0.02µm; Sz ~ 0.3µm)
ARC vs. SPUTTER coating technology

Hybrid LACS® technology

Simultaneous ARC and SPUTTER processes to combine the advantages of LARC® cathodes with those of central SPUTTERING SCIL®

Hybrid LACS® (LAteral ARC with Central SPUTTERING):

  • High ion density, excellent adhesion
  • High deposition rates
  • Introduction of “new” materials by SPUTTERING of ceramic targets
  • Smoother coatings
Hybrid LACS coating technology
  1. LARC® cathode
  2. LARC® cathodes
  3. LARC® cathodes
  4. Shutter
  5. SCIL® cathode
  6. Door
  7. Chamber
  8. Pumping
  9. ARC current source
  10. ARC current source
  11. LGD® pulsed source
  12. ARC current source
  13. BIAS source

High Ionized plasma by LGD® electrones stream (current) from cathode (3) to anode (2).

Sputtering deposition by SCIL® in a high ionozed plasma.

Two different types of this hybrid technology can be applied in the Pi411 coating unit

1. Simultaneous deposition by LGD® & SCIL®

Lateral Glow Discharge & SPUTTERED Coating Induced by Lateral Glow Discharge

  • To increase ion density and affect the coating properties of SPUTTER coatings

2. Simultaneous deposition by LARC® & SCIL®

ARC evaporation with LAteral Rotating Cathode & SPUTTERED Coating Induced by Lateral Glow Discharge

  • For targeted doping of coating components

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